Bonding is chip bonding, chip coating, also known as bonding. Bonding is a wire bonding method in the chip production process. It is generally used to connect the internal circuit of the chip with gold wires to the package pins before packaging. Generally, after bonding (that is, after the circuit and the pins are connected), the chip is packaged with black glue and used at the same time Advanced outer packaging technology COB (Chip On Board), the process of this process is to implant the tested wafer on a special circuit board, and then connect the wafer circuit to the circuit board with a gold wire, and then After melting, the organic material with special protective function is covered on the wafer to complete the post-package of the chip.
The bonding chip is anti-corrosion, anti-vibration and stable performance. The advantage of this packaging method is that the stability of the finished product is much higher than that of the traditional SMT patch method, because the currently widely used SMT patch technology is to solder the pins of the chip to the circuit board. This production process is not suitable In the processing of mobile storage products, there are problems such as false soldering, false soldering, and missing soldering in the packaging test. During daily use, the solder joints on the circuit board are exposed to moisture, static electricity, physical wear, and micro Natural and man-made factors such as acid corrosion make the product prone to short circuit, open circuit, and even burnout. The bonding chip connects the internal circuit of the chip to the circuit board package pins through gold wires, and then is precisely covered with organic materials with special protection functions to complete the later package. The chip is completely protected by organic materials and is isolated from the outside world without moisture. The occurrence of static electricity and corrosion; at the same time, the organic material is melted at high temperature, covered on the wafer and then dried by the instrument, and seamlessly connected with the wafer, which completely eliminates the physical wear of the wafer and has higher stability.
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